features ? plastic material has underwriters laboratory flammability classification 94v-0 ? ideal for printed circuit boards ? glass passivated chip junction ? reliable low cost construction utilizing molded plastic technique mechanical data ? case: molded plastic gbu ? terminals: leads solderable per mil-std-202 method 208 guaranteed ? mounting position: any absolute maximum ratings and characteristics rating at 25 ambient temperature unless otherwise specified. si ngle-phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%. symbols gbu 6005 gbu 601 gbu 602 gbu 604 gbu 606 gbu 608 gbu 610 units maximum recurrent peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current at t c = 100 (note 1) (note 2) i f(av) 6 a peak forward surge current 8.3ms single half-sine-wave superimposed on rated load (jedec method) i fsm 175 a maximum forward voltage at 3.0a dc and 25 v f 1 v maximum reverse current at t a = 25 at rated dc blocking voltage t a = 125 i r 5 500 a typical junction capacitance (note 3) c j 211 94 pf typical thermal resistance (note 1),(note 2) r ja 7.4 /w typical thermal resistance (note 1),(note 2) r jc 2.2 /w operating and storage te mperature range t j ,t s -55 to +150 notes: (1). units case mounted on 2.6x1.4x0.06? thick (6.5x3.5x0.15 cm) ai. plate heatsink.. (2). recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screws. (3). measured at 1mhz and applied reverse voltage of 4.0 vdc. gbu unit: inch (mm) .880(22.3) .160(4.1) .140(3.56) .040(1.02) .030(0.75) .100(2.54) .080(2.03) .190(4.83) .050(1.27) .080(2.03) .710(18.0) .085(2.16) .310(7.90) .740(18.8) .075(1.90)r .860(21.8) .140(3.5) .130(3.30) .030(0.76) .017(0.45) .085(2.16) .065(1.65) .210(5.33) .040(1.02) .060(1.52) .690(17.5) .065(1.65) .290(7.40) .720(18.3) ? gbu6005 thru gbu610 pb gbu6005 thru gbu610 6.0 ampere glass passivated flat bridge rectifiers pb free plating product ? 2006 thinki semiconductor co., ltd. http://www.thinkisemi.com/ page 1/2 rev.05
ratings and characteristic curves transient thermal impedance (c/w) junction capacitance, pf t,heating time (sec.) 0.1 10 reverse voltage (a) 50 - 400v 600 - 1000v 110 0.1 100 0.01 0.1 1 1 10 100 fig.6 typical transient thermal impedance 1.0 cycle number of cycles at 60hz fig.2 maximum non-repetitive peak forward surge current per leg 50 - 400v 600 - 1000v percent of rated peak reverse voltage (%) fig.4 typical reverse leakage characteristics per leg instantaneous forward current (a) instantaneous reverse current ( a) 500 100 fig.5 typical junction capacitance per leg 0.4 100 1000 0.01 0.1 10 1 1.6 1.4 1.2 1.0 0.8 0.6 20 0 t j =25c f=1.0mhz vsig=50mvp-p instantaneous forward voltage (v) 10 100 t j =25c pulse width = 300 s 1% duty cycle 1 0.1 0.01 100 10 60hz resistive or inductive load heatsink mounting. 2.6*1.4*0.06" thk (6.5*3.5*0.15cm) al. plate average forward output current (a) 0 0 2.0 4.0 6.0 peak forward surge current (a) 100 fig.3 typical forward characteristics per leg case temperature (c) 50 100 25 150 1 50 75 fig.1 derating curve output rectified current 150 125 175 100 80 60 40 t j =25c t j =125c 10 100 single sine-wave (jedec method) t j =150c ? gbu6005 thru gbu610 ? 2006 thinki semiconductor co., ltd. http://www.thinkisemi.com/ page 2/2 rev.05
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